Apple has partnered with Samsung to produce next-generation chips, specifically advanced image sensors, for upcoming iPhones. These chips will be manufactured at Samsung’s semiconductor fab in Austin, Texas, using a new and innovative chipmaking technology that has never been used before anywhere else in the world. This collaboration is part of Apple’s broader $100 billion expansion under its American Manufacturing Program to bolster domestic supply chains and technology development. The technology involves a specialized hybrid bonding process for vertically stacking wafers, aimed at enhancing power efficiency and performance in Apple products, including the iPhone 18 lineup expected next year. This marks a significant revival of Apple-Samsung semiconductor cooperation, which had been dormant since their past legal disputes.
Here is the key details include:
- Samsung’s System LSI division designing the custom image sensors.
- Manufacturing to occur at the Austin, Texas plant.
- The technology is expected to optimize power consumption and performance of iPhone devices globally.
- This partnership helps Apple diversify its supply chain, reducing reliance on previous dominant suppliers like Sony.
- The move aligns with U.S. efforts to reshore semiconductor manufacturing amid geopolitical and trade challenges.
This agreement is an important strategic win for Samsung, which has faced losses in its logic chip business, while for Apple it represents a major investment in U.S.-based chip production and technological innovation.